Apple's foldable iPhone will trigger a 46% year-over-year jump in panel shipments in 2026, according to Counterpoint Research. Samsung Display will capture over 50% of the booming market ...

The US Department of Commerce cleared Anthropic to restore access to Claude Fable 5 and Claude Mythos 5, ending a nearly two-week suspension triggered by export control restrictions. The company had ...

Google is bringing Gemini Spark, its autonomous AI agent, to the native Gemini Mac app alongside voice support and background task execution. Gemini Spark is available today only to Google AI Ultra ...

Anthropic has released Claude Sonnet 5, replacing Sonnet 4.6 as the default medium-sized model for both Free and Pro Claude users. Sonnet sits between Anthropic’s smaller Haiku model and its larger ...

The CMA wants to require Apple to share NFC technology and let developers direct users to third-party payment options, with fees capped below current App Store commissions.

Anthropic has released Claude Science, a new desktop app that joins the existing Claude lineup on the Mac and brings dedicated research tools to scientists working with genomics, proteomics, and ...

Apple’s next major Apple Watch redesign is coming in 2027 with the Series 13, according to a known Weibo leaker, and it will change how bands attach to the case while creating internal space for a ...

Bose's noise-cancelling headphones hit $179, down from $349. Get 24-hour battery, multipoint Bluetooth, and dual listening ...

Over 630GB of confidential Apple documents stolen from Tata Electronics expose iPhone 18 Pro schematics, components, and ...

Apple has released iOS 26.5.2 and iPadOS 26.5.2 for all compatible iPhone and iPad models. These bring important security and bug fixes. You can download the iOS 26.5 ...

TrendForce reports Apple is targeting 95% BT.2020 coverage for f MacBook Pro, iPad Pro, and iMac displays, a big leap beyond ...

An alleged image of the iPhone 18 Pro motherboard has leaked online, showing the A20 Pro chip integrated into TSMC’s new Wafer-Level Multi-Chip Module packaging architecture and adding visual evidence ...