Qualcomm is finally getting serious about AI infrastructure, but its push into the datacenter hinges on the success of an ...
DeepSeek just released DSpark, an inference module that makes its AI models 60% to 85% faster without new hardware. Nvidia is ...
STMicroelectronics unveils new compact direct Time-of-Flight 3D LiDAR module bringing high-resolution spatial awareness to ...
Next month ST will begin volume production of a compact direct Time-of-Flight 3D LiDAR all-in-one module which delivers AI-ready output data for low-compute edge AI systems on small MCUs and ...
LFM2.5-230M proves that while 3-billion-parameter models like VibeThinker are solving advanced calculus, a ...
DSpark can make decoding faster, but acceptance quality still determines how much speed the system actually realizes.
STMicroelectronics unveiled VL53L9, a 3D LiDAR module with 2,268 sensing zones and AI-ready depth output. The module supports low-compute edge AI applications with on-chip processing and ...
Q: Are chiplets simply an evolution of multi-chip modules (MCMs) from the 1990’s? A: In many ways, yes. Early multi-chip ...
DRAM prices surged over 60% in 2025 as AI demand strains chip supply, raising inflation concerns ahead of key core PCE data.
Lenovo AI server backlog has swelled to $21 billion as high-bandwidth memory shortages stall China’s AI compute build-out. SK ...
Interesting Engineering on MSN
New factory-prefabricated modular solution scales data centers from MW to GW class
An AI infrastructure firm, KAYTUS, has unveiled a gigawatt-scale containerized liquid-cooled data center solution.
Under the hood, the Steam Machine packs a semi-custom AMD platform: a 6-core, 12-thread Zen 4 CPU clocked up to 4.86GHz, an ...
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