The megatrend in electronic design today is end-to-end collaboration across ICs, packaging, PCBs, systems, data centers, and ...
UCIe channels are short, dense, highly parallelized and forced into a packaging environment requiring multiple layers. The ...
Q: Are chiplets simply an evolution of multi-chip modules (MCMs) from the 1990’s? A: In many ways, yes. Early multi-chip ...
Stackups can range from the simplest four-layer PCB to complex stackups requiring sequential lamination. Let's take the humble four-layer PCB. PCB designers not familiar with fabrication may be ...
Yet when it’s time to send a design to manufacturing, many organizations still fall back on a process that hasn’t fundamentally changed in decades – export Gerbers, generate drill files, create ...
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