UK-based Dynex Semiconductor has announced the development of a new 450A, 650V GaN half-bridge power module, designed to ...

KnowMade has launched two patent monitoring services dedicated to SiC technology: the SiC Substrates & Epitaxial Wafers ...

Advanced chip packaging, which boosts computing power for artificial intelligence, has made the United States more reliant on ...

Optical interconnects, leveraging intrinsic advantages such as high bandwidth, low loss, and immunity to electromagnetic interference (EMI), are thus regarded as a promising solution to these barriers ...

GlobalFoundries (GF) has confirmed that its SLATE wafer-to-wafer bonding technology has reached production readiness on the ...

A leaked iPhone 18 Pro motherboard hints at major A20 chip upgrades, including a new packaging design, better thermal ...

IICIE Emphasizes semiconductor materials, wafer fabrication equipment, packaging and testing, 2.5D/3D advanced packaging, and ...

As the global artificial intelligence (AI) boom puts intense pressure on data centre energy grids, some Chinese chipmakers ...

The "Smart Power Fab" is one of the world's largest manufacturing plants for power semiconductors, used in power supplies, ...

The recently reported cyberattack against Tata Electronics is shaping up to be one of the most consequential attacks exposing ...

Explore how onsemi (NASDAQ:ON) expands edge AI capabilities through the Synaptics transaction, strengthening semiconductor ...

Apple's fall announcements will include the iPhone 18 Pro and iPhone Ultra. Here's what to expect from the chip that will ...