UK-based Dynex Semiconductor has announced the development of a new 450A, 650V GaN half-bridge power module, designed to ...

KnowMade has launched two patent monitoring services dedicated to SiC technology: the SiC Substrates & Epitaxial Wafers ...

Microchip Technology recently announced the availability of its new 3,3 kV HV‑D3 mSiC Power Modules, designed to simplify and accelerate the adoption of solid-state transformers ...

Advanced chip packaging, which boosts computing power for artificial intelligence, has made the United States more reliant on ...

A new class of medium-voltage power modules has been introduced to support next-generation energy infrastructure, offering ...

SHENZHEN, GUANGDONG, CHINA, June 22, 2026 /EINPresswire.com/ -- In a rapidly evolving semiconductor landscape, GNS ...

GlobalFoundries (GF) has confirmed that its SLATE wafer-to-wafer bonding technology has reached production readiness on the ...

IICIE Emphasizes semiconductor materials, wafer fabrication equipment, packaging and testing, 2.5D/3D advanced packaging, and ...

The "Smart Power Fab" is one of the world's largest manufacturing plants for power semiconductors, used in power supplies, ...

GlobalFoundries (Nasdaq: GFS) (GF) today announced the production readiness of its SLATE™ wafer-to-wafer bonding technology on its industry-leading 9SW radio-frequency silicon-on-insulator (RF-SOI) ...

Partnership unites UWBG semiconductor & advanced packaging materials for HVDC grid technology to unlock massive power ...

The recently reported cyberattack against Tata Electronics is shaping up to be one of the most consequential attacks exposing ...