Thousands of attendees gathered at ECTC to explore the latest advances in advanced packaging, AI-driven design, heterogeneous integration and thermal management. More than 2,700 attendees conversed ...

The floodgates for chiplet-based design have officially opened. Over the past several quarters, manufacturing test flows have been validating 2.5D package architectures, and production volumes are ...

As global businesses continuously pursue innovation and efficiency, the adoption of artificial intelligence (AI) within enterprise resource planning (ERP) systems is rapidly reshaping organizational ...

The energy industry is undergoing a major transformation. The push for transition, the rise of advanced technologies and the need for operational efficiency are reshaping the sector. At this ...