Abstract: This paper presents a review of the wafer-to-wafer alignment used for 3-D integration. This technology is an important manufacturing technique for advanced microelectronics and ...
Abstract: This article describes a correct by construction approach to synthesize electrically and designs compliant design. By taking advantage of layout hierarchies they are able to apply this to an ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results