Multiphysics Fusion™ solutions for customer deployment. As chip complexity increases, physics-related challenges including ...

The latest wave of simulation technology releases from Ansys, Cadence, and Avnet underscores a growing convergence of ...

Abstract: Interdigitated Electrodes (IDEs) based sensor in comb-like electrodes structure is also an attractive candidate in gas sensor and biosensor applications, owing to its simple structural ...

For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet increasingly complex, set of challenges: how do we manage power, dissipate ...

Abstract: This article introduces a novel multiphysics modeling framework for the high-fidelity simulation of superconductors in microwave. The proposed approach integrates the time-dependent Ginzburg ...

The latest version of the multiphysics simulation software introduces GPU acceleration through NVIDIA's CUDA® direct sparse solver, the Granular Flow Module and time-explicit structural dynamic ...

BURLINGTON, Mass., Nov. 18, 2025 (GLOBE NEWSWIRE) -- COMSOL, a global leader in modeling and simulation software, today announced the release of COMSOL Multiphysics® version 6.4, which introduces new ...

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

Multiphysics simulation helps engineers understand the interaction of thermal, structural, acoustic, fluid, and electromagnetic effects in complex systems. Accurate material properties are crucial; ...

It’s surprising to learn that the idea of 3D integrated circuits (3D ICs) has been kicking around for over sixty years. Not long after the first MOS IC emerged in 1960, researchers were already ...