Doug Wintemute is a staff writer for Forbes Advisor. After completing his master’s in English at York University, he began his writing career in the higher education space. Over the past decade, Doug ...
Abstract: In this article, a high-efficient design method of through silicon via (TSV) array for thermal management of 3-dimensional (3-D) integrated system is developed based on the equivalent ...
Abstract: With the continuous progress of chip integration, the three-dimensional integration technology based on silicon through-hole (TSV) has emerged and become one of the key technologies to ...
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